Foam Afff 3% Aqueous Film-Forming Foam Concentrate Fire Fighting Foam Concentrate

Taking into account the importance of product development and technical innovation, our company designs Extruded Aluminum Heat Sinks, Stamping Plate, Copper Heatsink Extrusion based on the philosophy of simplicity, environmental protection, science and stability. We strive to build a new highland of talent advantage in the era of knowledge economy and build the competitiveness of our company. In order to ensure the continuous innovation of products and after-sales service, we have trained a number of design and after-sales personnel to be based on integrity and innovation for development. We strive for survival by quality, development by science and technology, reputation by service, excellent after-sales service has won the trust of users.

Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.

The heatpipe is one phase thermal solution while Vapour Chamber Liquid cooling is two phase thermal solution, so the Vapour Chamber efficiency is higher.

Vapour Chamber can be integrated with either aluminum or copper heatsinks, this combination makes a new micro liquid cooling system.

The simplest method is to solder a vapor chamber to the base of an extruded heatsink. A more thermally efficient method is to solder a stack of stamped fins directly to the surface of a vapor chamber. To improve the dimensional integrity, these fins are often interconnected by locking tabs called zipper fins.

Benefits & Advantages:

1. Low thermal resistance, Rca can lower to 0.05℃/W under 300W power input with 30mm*30mm heat source size.

2. Flexible design for any size and shape with different applications required.

3. Increase more thermal performance in limit designed space.

4. Maintain Devices cooler by alleviating spreading resistance.

Specifications:

With the development of technology and manufacturing process improved, vapour chamber liquid cooling is now more and more used in different areas, such as, gaming device, CPU, GPU, notebook, smart phone, telecom device, lightning applications.

Below specifications are just for technical reference only, please contact Sinda Thermal engineer for your customized design.

Application	Power	Size L x W (mm)	Thickness (mm)	Material
Gaming console	150 - 250W	150 x 150	3 – 5	Cu
Telecom Base Station	50 - 100W	100 x 100	2 – 4	Cu/Cu alloy
Graphics Card	200 - 350W	220 x 90	2 – 4	Cu/Ti
Server	200 - 400W	80 x 150	3 – 4	Cu
Inverter (IGBT)	500 - 2000W	450 x 450	3 – 8	Cu
Laptop	15-25W	220 x 60	0.5	Cu alloy
Mobile Phone	5W	80 x 50	0.3 - 0.4	Cu alloy
Mobile Phone	5W	80 x 50	0.4	Stainless Steel

Applications:

CPU & GPU

Latop & Smart Phone:

Lightning:

Vapour Chamber Process Review:

FAQ:

Q: What is the expected tooling cost for a new design.

A: The tooling cost is dependent on product size and downstream additions of components to the assembly.

Q: What is the lead-time?

A: Usually, 2 weeks design, 4 weeks proto, 8 weeks tooling.

Q: What test will be included before shipping?

A: Thermal Cycling & Thermal Shock, Shock & Vibration Testing, Packaging Drop Testing, etc, according to customers’ requirement.

Maintaining a leading position in Foam Afff 3% Aqueous Film-Forming Foam Concentrate Fire Fighting Foam Concentrate technology, quality and after-sales service is the foundation of our development. We are honest and trustworthy, adhere to the principle of equality and mutual benefit and serve you wholeheartedly. We will continue to gradually complete the upgrading of our brand strategy of grouping and diversifying hand in hand.

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