Large Machining Boiler Condenser Heat Exchanger Component Tube Sheet and Baffle Plate

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Description:

Copper bolier plates enable high heat transfer from high flux heat sources like CPUs and GPUs with no moving parts, enabling greater reliability and longer product lifetimes. Customers can boost performance for chips with high heat dissipation where standard air cooled or liquid cooled solutions cannot meet application requirements.

Specification:

Contact Plate:

Solid copper base plate

Copper/water vapor chamber

Boiling Enhancement Surface (BEC):

Sintered copper powder

Mounting Frames (Optional)

Aluminum

Features & Details:

Benefits & Advantages:

High thermal conductivity and small space occupation

Flexible customization

Fast response and available solution apply

FAQ:

Q: What’s the lead time of this kind of heatsink?

A: Normal LT is 6-8weeks.

Q: Is there any MOQ requested?

A: No MOQ limited.

Q: Where’s your factory located?

A: We located in DongGuan, China.

Q: How can I get the quotation?

A: Please send us the emails with your drawings, requirements, spec, We will reply to you within 24 hours.

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