
Skived Ultra-Thin Fin Copper Heat Sink for Ipc CPU & Chipset
Skived Fin Copper Heat Sinks offer highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint that restricts heat flow like bonded or brazed fin heat sinks.
Product Introduction
Our professional production and technical staff ensure that our Copper Heatsink Extrusion, Extruded Aluminium Heat Sink, Nickel Plated Stamping Plate meets industry standards and exceed customer expectations. Our company has been looking for partners in the rapidly developing international market and actively expanding international business. Our company encourages the progress of research and development personnel, so that their academic and technical achievements are highly recognized within the group.
Product Description:
Skived Fin Copper Heat Sinks offer highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint that restricts heat flow like bonded or brazed fin heat sinks. Unlike bonded or brazed heat sinks, Skived Fin Heat Sinks are constructed from a single piece of material and offer reduced thermal resistance since there is no joint between a base and fins. These heat sinks are manufactured by precisely slicing the top of the base, called skiving, folding it back to where it is perpendicular to the base, and repeating at regular intervals to create fins.
Benefits & Advantages:
1. Using a cutting tool with skiving saves tooling costs.
2. Skiving enables economical solid copper heat sink solutions not available in other processes.
3. Fin geometries available with skived fin heat sinks offer more surface.
area, enable higher heat transfer, and overall better performance.
4. The integrated structure means better thermal conductivity.
5. Add a thermal interface material to better connect with your heat source and complete your thermal solution.
Quick Details:
Material | Copper |
Normal Specifications | Fin Thicknesses: 0.2- 1.0 mm |
Process | Skiving and CNC |
Surface Finish | Copper Wash, Anodizing, Antioxidants, Nickel Plated, etc |
Size | Customized |
Place of Origin | DongGuan, China |
Shipping Port | Shen Zhen or HongKong, China |
Payment Term | T/T in advance, for long-term business, this can be negotiated |
Product Exhibitions:
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Packaging & Shipping:
Delivery | 20~30 days after confirming all inforamtions |
Packaging | Standard export package, we can also accept other customized requirement |
Shipping | 1. The sample will be shipped by express, like FEDEX, DHL, UPS and EMS, etc. 2. FOB Shenzhen or HongKong for mass production, the freight will deal with you for the concrete condition. 3. And the freight should be paid by clients. |
FAQ:
Q: Are you trading company or manufacturer?
A: We are manufacturer for the CNC machining, extrusion, skived fin process, soldering assembly, brazing, CPU Cooler, stamping fin process, liquid cooling plate, vapor chamber and various metal parts.
Q: Can I make samples out of your specifications?
A: We keep optimizing our processing capacity, please contact us for double check.
Q: What’s your quality certification?
A: SGS, REACH, ROHS, GB/T19001-2016, ISO9001:2015
Q: How can I know more about the product process?
A: We can share you more technical file or video for details review.
Q: What’s your capacity for skived fin heats sink?
A: We can make more than 10000pcs /month in our own factory.
We provide solutions through technological innovation, continuously promote the progress of the Skived Ultra-Thin Fin Copper Heat Sink for Ipc CPU & Chipset industry, and unswervingly practice the corporate core value of "creating value is the only way to have value". We believe that a strong enterprise will also promote local economic development, increase employment and improve the community environment. Based on the enterprise, we constantly improve the training mode of skilled talents, carry out the training work of high skilled talents, and promote the development of enterprise scientific research and production.
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