China Stamping Part Manufacturers Factory Suppliers

Stamping fin heatsink can offer a thermal performance improvement of up to 20% compared with typical aluminum or copper base spreaders particularly in applications like electronics or computers,...

Material:Aluminum alloy 1100;
Process:Stamping,skiving;
Surface finish:nickel plating;
Application:LED,Server,CPU,GPU.

Material: CU1100;
Heat sink type: Skiving fin,zipper fin,bonded fin;
Surface finish: Passivation,copper wash;
Application: CPU, GPU, IGBT, etc.

Material: AL6061,6063;
Certification: RoHS, ISO9000, ISO9001;
Surface finish: Anodizing, nickel plated; Location: China.

Material: AL6061;
Surface finish: Anodizing, nickel plated;
Application: IGBT; Package: Carton, wooden box.

Material: AL1050 or Cu1100;
Certification: ISO9000,ISO9001;
Location: Dongguan City China;

Material: AL1050;
Surface finish:nickel plating;
Dimension:customized;
Package:Standard packing.

Material: AL1100;
surface finish: nickel plating;
Process: stamping, soldering.

Zipper fin material: Copper 1100;
Base material:die casting DAC12;
Pedestal material:Copper 1100;
surface finish:copper wash;
Process:Soldering;
Packing:Tray and carton.

The aluminum zipper fin heat sink is uniquely designed with a series of zipper-like fins interconnected to form an efficient heat dissipation path. When heat generated by electronic devices passes...

Stamping fin heatSinks with plate are an ideal air cooled solution for high power forced convection applications for mass production.usually it contains some heat pipes for rapid heat transferring.

Stamping fin assembly with fan are pre-assembled complete thermal solutions for a variety of board level applications. Save time and space while increasing thermal performance with these compact...