Aluminum Heat Sink Extrusion For FPGA

  The application of physical computing to modern electronics has become increasingly prevalent. Field-programmable gate arrays (FPGA) are a type of integrated circuit (IC) device used to facilitate physical computing applications. Heat dissipation is essential to keep FPGA systems running at peak performance and to prevent device failure due to overheating. Aluminum heat sink extrusion is a cost-effective solution for dissipating heat produced by FPGA systems.

  Aluminum heat sink extrusions are made by forcing molten aluminum through a die at high pressure, forming a variety of shapes. Heat sinks are designed to dissipate heat by dispersing it into the environment and away from the IC device. Extruded aluminum heat sinks are commonly used in cooling applications and can be designed to fit directly on top of the FPGA device, making the installation and removal process easy.

  Aluminum heat sink extrusion can be customized to suit the needs of the application. Extrusion design allows for a variety of shapes and sizes, so heat sink extrusions can be tailored to fit almost any form factor. The aluminum alloy and core design of the extrusion can also be customized for specific applications.

  Aluminum offers a cost-effective solution for dissipating large amounts of heat from an FPGA. It is lightweight, strong and has high thermal conductivity and can offer solutions for less space while maintaining optimal performance. An additional advantage of aluminum heat sink extrusion is that it is inherently economical and environmentally friendly.

  Aluminum extrusion technology is a cost-effective solution for dissipating heat produced by FPGA systems. With the right design and alloy selection, aluminum heat sink extrusions can effectively dissipate heat from FPGA devices. This kind of extrusion technology will help to improve the long-term performance and reliability of the FPGA in an efficient and cost-effective manner.

 

Product specifications

 

Material	Aluminum alloy	Certificates	ISO 9001:2015,ISO 14001:2015
Product dimension	Customized	Type	Extruded heat sink
Process	Extruding, CNC, drilling	Lead time	2-3 weeks
Surface finish	Anodizing	Packing	Tray, carton
OEM/ODM	Yes	Quality control	100%
Application	CPU, inverter,IGBT,LED,BGA,etc.	Warrantly	1 year

 

Heat sink types

 

 

Thermal simulation

 

 

Factory and workshop

 

 

Certificates

 

 

 

  Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is devoted to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, Madical and Military. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .

 

 

FAQ

 

1, Q: Are you a manufacturer or trading company?

    A: We are a leading heat sink manufacturer in China, our facory has been founded over 8 years and located in Dongguan City, Guangdong province, China. 

 

2, Q: Can you provide ODM or OEM service?

    A: Yes, ODM and OEM service is available.

 

3, Q: Can I print my content in the heat sinks?

    A: Yes, we can print the content as customer requsted.

 

4, Q: Can I visit your factory to audit?

    A: Yes, welcome to visit our factory.

 

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