3 reference points for medical electric PCB heatsink design
Overheating of medical electric PCB ususally leads to partial failure or even complete failure of equipment. Thermal failure means that we need to redesign PCB. How to ensure that appropriate thermal management technology is important in the design and the following three skills can help you with relevant projects.
1. Add heatsinks, heat pipes, or fans to the high heating device:
If there are several heating devices on the PCB, a radiator or heat pipe can be added to the heating element. If the temperature cannot be reduced sufficiently, a fan can be used to enhance the heat dissipation effect. When the number of heating devices is large (more than 3), you can use a larger radiator, select a larger radiator according to the position and height of the heating device on the PCB, and customize the special radiator according to the different height positions of the components.
2.Design PCB layout with effective heat distribution:
Components with the highest power consumption and heat output shall be placed in the best heat dissipation position. Unless there is a radiator nearby, do not place high-temperature components at the corners and edges of the PCB board. When it comes to power resistors, please select larger components as much as possible, and leave enough heat dissipation space when adjusting the PCB layout.
The heat dissipation of the equipment largely depends on the air flow in the PCB equipment. Therefore, the air circulation in the equipment should be studied in the design, and the component position or printed circuit board should be arranged correctly.
3. Add thermal PAD and PCB hole can help to improve the heat dissipation performance
Thermal pad and PCB hole help to improve heat conduction and promote heat conduction to a larger area. The closer the thermal pad and the through hole are to the heat source, the better performance . The through hole can transfer the heat to the grounding layer on the other side of the board, which helps to evenly distribute the heat on the PCB.
In a word, please try to avoid design heat source too concentrated on PCB, distribute the thermal power consumption evenly on the PCB as much as possible, and strive to maintain the uniformity of PCB surface temperature. In the design process, it is usually difficult to achieve strict uniform distribution, but areas with excessive power density should be avoided.
