Industry news

With the explosive demand for AI computing power and the increase in server power consumption, the industry must apply new technologies to efficiently remove heat, and liquid cooling technology wil...

In today's era of high-performance computer hardware, an efficient and reliable cooling system is crucial for maintaining computer performance. Recently, MSI officially released the MAG CORELIQ...

The market size of China's CPU heat sink reached 25.317 billion CNY in 2022, and the global CPU heat sink market size reached 66.292 billion CNY in the same year. The research report on the CPU...

JONSBO has released an M.2 2280 SSD solid state drive heatsink that is compatible with the M.2 2280 specification M.2 SSD. The installation is simple and fixed with four screws. The U-shaped base b...

TSMC stated at its annual technology seminar that the power consumption of each chip and rack unit in the computing field will not be limited by traditional air cooling. When the chip packaging pow...

Recently, Huawei held a press conference on the top ten trends in data center energy for 2024 and released a White Paper. At the press conference, Yao Quan, President of Huawei Data Center Energy, ...

Recently, ThermalWorks announced the global launch of its most advanced water-free cooling system, designed specifically for the rapidly changing data center industry. The ultra efficient modular d...

Recently, Samsung announced that its latest flagship phones, the Galaxy S24 and S24+, will be equipped with its own Exynos 2400 processor in some markets, which is produced using various new techno...

According to the 2023data center liquid cooling market analysis report, the data center liquid cooling market will grow at a compound annual growth rate of 25.8% from 2023 to 2032. The growing dema...

Recently, during the World Internet Conference Summit, Industrial Rich Union and Intel jointly released the next generation of advanced cooling technology, aiming to break through the limits of cur...

Samsung Electronics recently attended an international electronic packaging seminar held in Busan, introducing the "immersion cooling" solution. As semiconductor miniaturization reaches i...

On January 17, 2024, according to the announcement of the China National Intellectual Property Administration, Shenzhen Mindray Biomedical Electronics Co., Ltd. obtained a project entitled "Ul...