China AMD CPU Back Plate Manufacturers Factory Suppliers

For most of the applications, the motherboard CPU socket small backplane (all motherboards) and the radiator fan backplane (screw fixed heat dissipation) share the design.

Material: copper 1100;
Surface finish:copper wash;
Process:soldering;
Certification: Rohs.

Material: AL1100;
surface finish: nickel plating;
Process: stamping, soldering.

Copper fin heatsink has better thermal performance due to the high thermal conductive of copper material, so copper fin are often used on high performance CPU heatsink

Copper stamping plate is a thermal product made by stamping process,copper coil is one time forming by a stamping tooling.

Product Description: Stamping Fin heat sinks are an ideal air cooled solution for high powered forced convection applications for mass production. A zipper fin stack is constructed from a series...

Heatsink type:Crimped fin heat sink

This CPU heat sink is designed for AMD 1U servers series processors. The heat sink has been fully tested and validated by Sinda Thermal to ensure the best quality and cooling performance before...

Nickel Plated Stamping Plate has very good mechanical strength, corrosion-resistant and heat-resistance strength. it’s widely used in battery,vehicles, thermal modules, industrial equipment, PC,...

What is a back plate ： In short, it’s a plate that goes to the back of your graphics card. Its purpose is mostly to keep the graphics card in shape, as modern GPUs tend to come with large PCBs and...

Our Copper Block Assembly Sink is designed for Intel newly platform high performance CPU heat sink, includes 1U and 2U modules, Usually, these heat sink modules contain aluminum base, zipper fin,...

Stainless Steel Plate is smooth and clean by using one-time stamping Forming process, it has high plasticity, toughness and mechanical strength.