Vapour Chamber Heat Sink

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Vapour chamber heat sink is generally used in high power devices such as Server, Telecom, high power LED, etc. as vapor chamber can absorb the heat from the heat source and spread it rapidly to fins , vapor chamber heat sink is a two phase thermal solution, it not only spreads the heat but also conduct it to the cold area for cooling.

The vapor chamber is a structure of sealed copper plates forming a vacuum cavity,the material of VC plates is usually C1020, inside the cavity there will be a lot of copper pillars to reinforce the strength of the VC, and it will be filled small amount of water to transfer the heat from the heat source when the water is vaporized, Also put copper mesh to increase the capillary force to drive the condensate back and recyle the cooling process. 

 

The Working principle of vapor chamber

Vapor chamber is a flat heat pipe, so the working principle of VC is very similar with heat pipe, but vapor chamber can transfer the heat in two dimensions, it's usually used in high heat density and flux applications. In operation, the fluid in the envaporator area would be vaporized when heated by the heat source, then the vapor flows the whole chamber, and spread the heat rapidly, when the vapor arrives at condenser side, it condenses to a liquid water and release the heat, the liquid flows back to the envaporator side with the capillary force of the mesh wick. 

The working principle of vapor chamber has similarities and differences with heat pipe, but it also generally includes four steps of conduction → evaporation → convection → condensation.

Firstly, the heat generated by the heat source (chip) is conducted to the evaporation end of the vapor chamber, and the condensate inside will quickly absorb the heat and convert it into steam, thereby taking away a large amount of heat energy. Due to the latent heat of water vapor, the hot steam of the vapor chamber will diffuse from the high pressure area to the low pressure area (condensing end), and when the steam contacts the inner wall with a lower temperature, it will quickly condense into a liquid and release heat . Finally, these liquids will flow back to the evaporation end by capillary action, eventually forming a two-phase circulation system with coexistence of water and gas.

The difference between the heat pipe and the VC is mainly reflected in the internal conduction mode. The heat pipe is subject to the "strip" shape, and the heat (hot steam) can only be conducted linearly in the left and right directions. In addition, a layer of heat dissipation substrate is often embedded between the heat pipe and the heat source (chip), and the material, area and filling of the latter will also affect a certain thermal conductivity.

But for the vapor chamber, thanks to its "sheet-like" shape, the heat can be conducted in multiple horizontal directions, the condensation efficiency is higher, and its contact area with the heat source and the heat dissipation medium is larger, which can make the surface temperature higher. evenly. The thermal resistance can be further reduced due to the vapor chamber and direct contact with the heat source without the need for a base.

 

 

 

Product pictures

 

 

 

 

Why choose us?

• Professional engineering team and experienced manufacturing team, we are experienced and resourceful.
• Adequate facilities to support varous demand and requirements.
• A excellent quality system to ensure the quality of products to our customer.
• Best service and competitive price.

 

FAQ:

Q: Can the vapor chamber solve over 300w application?

A: Yes, the vapor chamber heat sink can be customized design.

 

Q: Does your products meet the Rohs certificates?

A: Yes, all products are meet the Rohs certificates.

 

Q: Can I place a prototype order for NPI build?

A: Yes, sample order is available.

 

Q: What's the package of the vapor chambers?

A: Usually we use stanard exporting packing, tray, carton, but it can be customized.

 

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