Stamping heat sink

Material: AL1100;
surface finish: nickel plating;
Process: stamping, soldering.

Zipper fin material: Copper 1100;
Base material:die casting DAC12;
Pedestal material:Copper 1100;
surface finish:copper wash;
Process:Soldering;
Packing:Tray and carton.

The aluminum zipper fin heat sink is uniquely designed with a series of zipper-like fins interconnected to form an efficient heat dissipation path. When heat generated by electronic devices passes...

Copper fin heatsink has better thermal performance due to the high thermal conductive of copper material, so copper fin are often used on high performance CPU heatsink

Copper stamping plate is a thermal product made by stamping process,copper coil is one time forming by a stamping tooling.

Product Description: Stamping Fin heat sinks are an ideal air cooled solution for high powered forced convection applications for mass production. A zipper fin stack is constructed from a series...

Heatsink type:Crimped fin heat sink

This heatsink design is optimized for Intel® Xeon® Scalable Processors thermal solutions , it contains aluminum die casting base, aluminum stamping zipper fin , copper block, and 4 heat pipes to...

This CPU heat sink is designed for AMD 1U servers series processors. The heat sink has been fully tested and validated by Sinda Thermal to ensure the best quality and cooling performance before...

High Speed Stamping Sinks are made from a piece of metal being stamped out in a press

Micro thin stamping cooling heatsink is a product specializing in low-power device cooling applications.

Nickel Plated Stamping Plate has very good mechanical strength, corrosion-resistant and heat-resistance strength. it’s widely used in battery,vehicles, thermal modules, industrial equipment, PC,...