Stamping heat sink

What is a back plate ： In short, it’s a plate that goes to the back of your graphics card. Its purpose is mostly to keep the graphics card in shape, as modern GPUs tend to come with large PCBs and...

Stamping fin heatSinks with plate are an ideal air cooled solution for high power forced convection applications for mass production.usually it contains some heat pipes for rapid heat transferring.

Copper stamping sink is an assembly of a base and a stamped fin which are soldered ,brazed or epoxied together. Copper stamping sink has good thermal performance due to it allows high-density fins...

Stamping heat sink is a cost-effective solution, which can increase the surface area to increase the heat transfer of plate products. These radiators are formed by a progressive stamping process...

Compared with traditional heatsink, micro stamping sink has smaller size, simpler structure for lower performance required. Usually, it contains a stamping base thinner than 5mm, zipper fin, or...

Stamping fin heatsink can offer a thermal performance improvement of up to 20% compared with typical aluminum or copper base spreaders particularly in applications like electronics or computers,...

Stamping fin assembly with fan are pre-assembled complete thermal solutions for a variety of board level applications. Save time and space while increasing thermal performance with these compact...

Metal stamping is a manufacturing process used to convert flat metal sheets into specific shapes. It is a complex process that can include a number of metal forming techniques, For example,...

Stamping Zipper Fin heat sinks are an ideal air cooled solution for high powered forced convection applications for mass production. A zipper fin stack is constructed from a series of individual...

​The Sinda Thermal folded fins includes many different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat...

For most of the applications, the motherboard CPU socket small backplane (all motherboards) and the radiator fan backplane (screw fixed heat dissipation) share the design.

Our Copper Block Assembly Sink is designed for Intel newly platform high performance CPU heat sink, includes 1U and 2U modules, Usually, these heat sink modules contain aluminum base, zipper fin,...