Products

Compared with traditional heatsink, micro stamping sink has smaller size, simpler structure for lower performance required. Usually, it contains a stamping base thinner than 5mm, zipper fin, or...

Stamping fin heatsink can offer a thermal performance improvement of up to 20% compared with typical aluminum or copper base spreaders particularly in applications like electronics or computers,...

Stamping fin assembly with fan are pre-assembled complete thermal solutions for a variety of board level applications. Save time and space while increasing thermal performance with these compact...

Metal stamping is a manufacturing process used to convert flat metal sheets into specific shapes. It is a complex process that can include a number of metal forming techniques, For example,...

Stamping Zipper Fin heat sinks are an ideal air cooled solution for high powered forced convection applications for mass production. A zipper fin stack is constructed from a series of individual...

​The Sinda Thermal folded fins includes many different configurations that are manufactured for high heat transfer. Folded fins provide more surface area and design flexibility than extruded heat...

For most of the applications, the motherboard CPU socket small backplane (all motherboards) and the radiator fan backplane (screw fixed heat dissipation) share the design.

Our Copper Block Assembly Sink is designed for Intel newly platform high performance CPU heat sink, includes 1U and 2U modules, Usually, these heat sink modules contain aluminum base, zipper fin,...

Stainless Steel Plate is smooth and clean by using one-time stamping Forming process, it has high plasticity, toughness and mechanical strength.