• Thermosyphon CPU Cooler
    Thermosyphon CPU Cooler

    Thermosiphons are passive, two-phase thermal management components or systems that do not require mechanical pumps or other moving parts within the fluid loop.

  • 6 Heat Pipe CPU Cooler
    6 Heat Pipe CPU Cooler

    Heat pipes can be directly soldered or epoxied into grooves within the heat sink base enabling direct contact with the heat source, or they can be embedded into holes using a proprietary expansion...

  • CPU Fan Cooler heat Sink
    CPU Fan Cooler heat Sink

    CPU Fan Cooler Heatsink is pre-assembled complete thermal solutions for a variety of board level applications. Save time and space while increasing thermal performance with these compact solutions...

  • Laptop CPU Heatsink
    Laptop CPU Heatsink

    Laptop cpu heatsink, Made of copper heat pipe, aluminum fins, fans, Interface TIM material, Suitable for laptop computer.

  • Copper zipper fin CPU Heatsink
    Copper zipper fin CPU Heatsink

    Since copper material has very good thermal conductivity, by adding copper material in heatsink design will provide an impressive thermal solution for high TDP system application. Our copper CPU...

  • Skived Fin Process
    Skived Fin Process

    The skiving process enables high fin density and thin fin heat sink geometries for optimal thermal performance. By packing as much fin surface area into a given volume, skived fin heat sinks have...

  • Aluminium Skiving Fin Heatsink
    Aluminium Skiving Fin Heatsink

    ​Aluminium Skived Fin heatsinks can be an alternative to extruded heat sinks when looking for fin density parts which can’t be made by extrusion technology, or can be the alternative to...

  • Skived Fin Copper Heat Sink
    Skived Fin Copper Heat Sink

    Skived Fin Copper Heat Sinks offer highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint...

  • Copper Boiler Plate
    Copper Boiler Plate

    Copper bolier plates enable high heat transfer from high flux heat sources like CPUs and GPUs with no moving parts, enabling greater reliability and longer product lifetimes.

  • Vapour Chamber Liquild Cooling
    Vapour Chamber Liquild Cooling

    ​Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.

  • Copper Vapour Chamber Heatsink
    Copper Vapour Chamber Heatsink

    Copper Vapor Chamber sink operate like heat pipes, using evaporation and condensation of a fluid sealed under vacuum within a metallic envelope to transport heat.

  • Liquild Cooling Plate
    Liquild Cooling Plate

    Liquid cooling Plates are responsible for transferring heat from surfaces with high heat loads to the fluid used within a liquid cooling system. The performance of these components is critical to...

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