Products

4 U-shaped heat pipes two-way heat conduction technology;
Super cooling performance, can support 165W cooling solution;
12CFM fan, perfect combination of silence and performance;
8K...

1. The product comes with high silver content nano silicone grease, which effectively improves product performance 2. The heat pipe is in zero-distance contact with the CPU, which is conducive to...

it's compatible with Intel and AMD platform, 1. The fin folding and opening technology ensures that the fins are invariable or stacked. Except for the top fin, all other fins are designed with...

As copper has a much better thermal conductivity than aluminum, although the copper heatsink price is higher than aluminum heatsinks, the copper heatsink is still popular in some area especially...

1， PWM intelligent temperature-controlled fan, taking into account both performance and silence 2， Easy to install, fast and stable 3， Pre-brushed high-efficiency heat dissipation silicone...

Whitley is a new Intel platform to replace the purley platform, Sinda Thermal can manufacture the Heat sinks for optimized cooling for Intel Ice lake processor package*. This kind of CPU coolers...

Heat sink type:LGA 775 CPU cooler;
Components:zipper fins, heat pipes, fan;
Certificates: Rohs,ISO9000;
Application:computer CPU.

With the fast developing of information science and technology, the power of the CPU is continuous growing, and the heat which the high power CPU generated is also increasing. CPU cooling plays an...

This heatsink design is optimized for Intel® Xeon® Scalable Processors thermal solutions , it contains aluminum die casting base, aluminum stamping zipper fin , copper block, and 4 heat pipes to...

This CPU heat sink is designed for AMD 1U servers series processors. The heat sink has been fully tested and validated by Sinda Thermal to ensure the best quality and cooling performance before...

High Speed Stamping Sinks are made from a piece of metal being stamped out in a press

Micro thin stamping cooling heatsink is a product specializing in low-power device cooling applications.