Intel LGA 4189 EVAC 1U CPU Heat Sink

Aluminum zipper fin stack

Aluminum and copper are the most common materials for the heat sink, copper has better thermal conductivity than aluminum, but aluminum has better heat dissipation performance than copper, so use the aluminum as fin material can improve the heat dissipation performance. Aluminum zipper fin stack is manufactured by stamping the aluminum sheet to form a designed shape, and interlock each other with designed fin pitch, aluminum fin stack has lightweight, cost efficiency, great heat dissipation performance, ect. benefits. Sinda Thermal offers high aspect ratio, denser fin pitch and thinner fins to provide more heat dissipation area to improve the thermal performance.

heat pipe

Heat pipe: Heat pipe is a functional component, the thermal conductivity is better than any metal, it's the best option to transferring the heat from copper pedestal. Heat pipe is a high efficient thermal conductor which even is 1000 times better than a solid copper metal, a heat pipe consists of a copper tube, working fluid,  wick structure, the tube is sealed under vacuum condition, then injecting a small amount of working fluid which is usually deionized water, the inner wall is sintered copper powder to form a wick structure. When a heat source such as CPU generates heat, the working fluid vaporizes at the envaporator section, the vapor absorbs the heat and spreads to the other side of the heat pipe by air pressure, at the opposite end which is know as condenser, the vapor releases the heat and returns to the liquid form, with the capillary force of wick structure, it flows back to the envaporator end. Heat pipe is a two phase device by utilizing liquid and vapor phase to spread and transport heat efficiently, it's a crucial component for high power thermal management.

Aluminum base

 As aluminum has excellent mechanical properties, and it has lighweight, cheap cost benefits, so choose aluminum to build the substrate is a great choice. The function of aluminum base is not only a substrate, but also a thermal conductor, so the aluminum base is typically made of AL 6063 material which offers thermal conductivity of -200W(m-k), and this type of aluminum alloy has good hardness, it's not easy to be deformed, so it can protect the heat sink module significantly. The aluminum base is usually manufactured from a extrusion process to get the designed thickness, then puch the sheet to complete the overall dimenisons, after CNC, and nickel plating, The aluminum base can be finished, it usually soldered with heat pipes and aluminum zipper fins by soldering process.

Copper pedestal: we all know that copper has a better thermal conductivity than aluminum, so we utilize copper as pedestal to contact with CPU to remove the heat faster. you can obsessing the great thermal conductivity that if you heat one end of a copper metal, the other end will be hot quickly, so it proves that copper can transport heat very efficiently. The other reason of copper to be the heat sink material is that it has high corrosion resistance and high melting point. The copper also has many benefits as below:

Good thermal and electrical conductivity

Density ~ 0.321 lb/in³

Tensile strength of ~ 310 MPa

Easy malleability

Easy to recycle