Vapor Chamber CPU Cooler For Intel Alder Lake LGA1700 CPU

Vapor chamber

Vapor chamber is very similar with heat pipe, both of them are two phase cooling devices, but they are different, heat pipe only transport heat along the axis of cooper tube, and vapor chamber can spread the heat with all directions, so vapor chamber can spread the heat very quickly, and the temperature gap between two different area is very low. Vapor chamber often used in high heat flux applications as it can transport and spread the heat rapidly. A vapor chamber is diffusion-bonded by two copper plate to form a cavity, resembling heat pipe, vapor chamber also has wick structure and working fluid. During operation, the heat generated by heat source like CPU or other electronic components vaporizes the working fluid in envaporator end and absorb the heat, the hot vapor flows throughout the chamber, the hot vapor then condenses on the condenser area and release the heat, and the vapor turns into liquid, with the capillary force of wick structure, the working fluid returns to the envaporator end and cyculate the heat spreading process.

Copper fin stack

A copper zipper fin stack is constructed from a series of individual copper sheets which are stamped to the designed shape and height, then folded and zippered together by interlocking structure, the fin length and pitch can be vary by design different tooling dies, the fin density can be designed based on the application air flow requirements. A completed copper fin stack is soldered with vapor chamber, due to copper is the best conductor of heat in commercial metal, so the heat can be quickly transported to the fins, with the help of cooling fan, the heat will be dissipated out rapidly, so the thermal performance of the module is pretty great. So copper fin heat sink module is designed for high power applications, which can meet the thermal requirements of the high power electronic components.