Products

Material: C1020;
Certification: ISO9000,Rohs,CE;
Surface finish: Passivation, nickel plated.

Type: vapor chamber heat sink;
Material:C1020;
Application:High power devices.

The vapor chamber is usually used for electronic products that require a small volume or need to quickly dissipate high heat. At present, it is mainly used in products such as servers and high-end...

The vapor chamber is a vacuum chamber with a micro structure on the inner wall, usually made of copper. When the heat is transferred from the heat source to the evaporation zone, the cooling...

As the continuous improvement of chip power density, vapor chamber has been widely used in the cooling of high-power devices such as CPU, NP, and ASIC. Although vapor chamber can be considered a...

Product Description: With increased processor cores and performance for CPU/GPU, thermal design power (TDP) of these products are increasing. Traditional air-cooling solutions are sometimes...

Product Overview: Cold forging is a technical process for forming and forging profiles at room temperature. Cold forging materials are mostly aluminum and some alloys, copper and some alloys with...

Product Description: Vapor Chambers, which work familiar with heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUS, and high...

Aluminum extrusion heat sinks are usually used in LED, BGA, FBGA, PCBA etc. area, aluminum extruded heat sink is the most popular heat sinks in thermal industry for its most cost efficient, good...

This heat sink is a square pin fin board level heat sink, which is usually used to cool down the BGA and FPGA devices,this kind of heat sink is very common in thermal area due to its easy...

Computer is a very common tool in our life today, we use it to work, study, watch the movies and play games, but when the computer is working, the CPU will generate the heat accordingly, and if...

Product Description: UFO Shape CPU Fan Cooler is known as it's shaped like a flying saucer and has a copper structure. There is a huge base at the bottom with a heat dissipation capacity of...