Intel LGA 1700 2U Server CPU Cooler

Nickel plating process

Nickel plating is a technique of electroplating a layer of nickel on the surface of aluminum zipper fin, nickel plating is a critical process for the aluminum zipper fin stack, for the CPU heat sink module, the aluminum zipper fin stack need to be soldered with vapor chamber and heat pipes by the SN42BI58 solder paste, but the aluminum alloy could not be soldered directly, so we need to electroplate a layer of nickel to make the aluminum zipper fin stack and vapor chamber and heat pipes solder together. Also the nickel layer on the surface of the aluminum zipper fins can be decorative, and provide corrosion resistance, wear resistance to extend the service life of the heat sink module.

Vapor chamber+heat pipe construction

Both of vapor chamber and heat pipe are two phase cooling devices, the working principle is very similar, through the vapor and liquid two phase change to conduct and transport the heat. In this construction, vapor chamber contact with CPU to absorb the heat and spread it, for the 2U structure, we can utilize 3 heat pipes to transport the heat to the upper side of the aluminum zipper fin stack which can make the heat be dissipate faster, so the thermal performance of the CPU heat sink module can be significantly improved. Vapor chamber and heat pipe are the key cooling device in thermal design, the capability of heat transporting is much better than any other solid metal, combine these two device together can fully develop the thermal performance of the CPU heat sink module.

SHIN_ETSU 7921 thermal grease

When the vapor chamber contact with CPU, there will be some tiny gaps between the vapor chamber and CPU, as we know air is a bad conductor of heat, so the tiny gap will significantly increase the thermal resistance between the vapor chamber and CPU, so we need to utilize a material with high thermal condutivity to fill up these tiny gaps. For this CPU cooler, Sinda Thermal uses SHIN_ETSU 7921 thermal grease to ensure the vapor chamber contact with the CPU fully, the heat conductivity coefficient can be 6 W/m.k, it can greatly decrease the thermal resistance and improve the heat conductivity. Thermal grease is an essential part for a heat sink module, Sinda Thermal always using the best thermal grease to ensure the best thermal performance.